Memory cards and electronic machines

ABSTRACT

Provided is a memory card. The memory card includes interconnection terminals for electric connection with an external electronic machine. The interconnection terminals may be spaced from the front side of the memory card by a distance greater than the lengths of the interconnection terminals. Alternatively, the memory card may include other interconnection terminals between its front side and the former interconnection terminals. The former and latter interconnection terminals may be used for electric connection with different kinds of electronic machines.

PRIORITY STATEMENT

This application is a continuation of U.S. application Ser. No.14/335,868, filed Jul. 18, 2014, which is a continuation of U.S.application Ser. No. 14/256,960 filed Apr. 19, 2014, which is acontinuation of U.S. application Ser. No. 13/873,746 filed Apr. 30,2013, which is a continuation of U.S. application Ser. No. 12/961,966filed Dec. 7, 2010, which claims priority to Korean Patent ApplicationNo. 10-2010-0010989, filed Feb. 5, 2010, and claims the benefit of U.S.Provisional Application No. 61/282,041, filed Dec. 7, 2009, the entirecontents of each of which are incorporated herein by reference.

BACKGROUND

The present disclosure herein relates to a memory card and an electronicmachine, and more particularly, to a removable memory card and anelectronic machine including a socket into which a removable memory cardcan be inserted.

Memory cards are removable cards used in connection with variouselectronic machines such as computers, digital cameras, digitalcamcorders, cellular phones, and personal digital assistants (PDAs) forstoring or providing data such as image data and sound data. There aremany kinds of memory cards such as memory stick cards, secure digitalcards, compact flash cards, and smart media cards. Nonvolatile memoriesare usually used as memory cards, and flash memories are the most widelyused nonvolatile memories.

SUMMARY

The present disclosure provides a new type of memory card.

Example embodiments of inventive concepts provide memory cards. In someexample embodiments, the memory card may include a front side, a rearside, a first lateral side, a second lateral side, a top side, and abottom side, a first set of interconnection terminals on at least one ofthe top side and the bottom side, the first set of interconnectionterminals configured to operatively connect with an external electronicmachine. Each of the first set of interconnection terminals may has alength parallel to a first direction and the first set ofinterconnection terminals are along a second direction perpendicular tothe first direction, and at least some of the first set ofinterconnection terminals may be spaced apart from the front side by adistance greater than their lengths, respectively.

In other example embodiments of inventive concepts, there are providedelectronic machines. The electronic machine comprising a socket therein,wherein the socket includes a first set of interconnection terminalsconfigured to operatively connect with a first memory card; and a secondset of interconnection terminals configured to operatively connect witha second memory card. The first set of interconnection terminals and thesecond set of interconnection terminals are parallel.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of inventive concepts, and are incorporated in andconstitute a part of this specification. The drawings illustrate exampleembodiments of inventive concepts and, together with the description,serve to explain example embodiments of inventive concepts. In thedrawings:

FIG. 1 is a top perspective view illustrating a memory card according toan example embodiment of inventive concepts;

FIG. 2 is a bottom perspective view of the memory card illustrated inFIG. 1;

FIG. 3 is a sectional view taken along line A-A′ of FIG. 1;

FIG. 4 is a top perspective view illustrating another example embodimentof the memory card of FIG. 1;

FIG. 5 is a bottom perspective view illustrating the memory card of FIG.4;

FIG. 6 is a top perspective view illustrating another example embodimentof the memory card of FIG. 1;

FIG. 7 is a bottom perspective view illustrating the memory card of FIG.6;

FIG. 8 is a top perspective view illustrating another example embodimentof the memory card of FIG. 1;

FIGS. 9 and 10 are a front view and a top view for illustrating memorychips and a controller chip of the memory card of FIG. 8;

FIG. 11 is a top perspective view illustrating another exampleembodiment of the memory card of FIG. 1;

FIG. 12 is a bottom perspective view illustrating the memory card ofFIG. 11;

FIG. 13 is a bottom perspective view illustrating another exampleembodiment of the memory card of FIG. 1;

FIG. 14 is a top perspective view illustrating another exampleembodiment of the memory card of FIG. 1;

FIG. 15 is a bottom perspective view illustrating the memory card ofFIG. 13;

FIGS. 16 and 17 are a front view and a top view for illustrating memorychips and a controller chip of the memory card of FIG. 14;

FIG. 18 is a top perspective view illustrating another exampleembodiment of the memory card of FIG. 1;

FIG. 19 is a bottom perspective view illustrating the memory card ofFIG. 18;

FIG. 20 is a top perspective view illustrating another exampleembodiment of the memory card of FIG. 1;

FIG. 21 is a bottom perspective view illustrating the memory card ofFIG. 20;

FIG. 22 is a top perspective view illustrating another exampleembodiment of the memory card of FIG. 1;

FIG. 23 is a bottom perspective view illustrating the memory card ofFIG. 22;

FIG. 24 is a bottom perspective view illustrating another exampleembodiment of the memory card of FIG. 1;

FIG. 25 is a bottom perspective view illustrating another exampleembodiment of the memory card of FIG. 1;

FIG. 26 is a bottom perspective view illustrating another exampleembodiment of the memory card of FIG. 1;

FIG. 27 is a bottom perspective view illustrating another exampleembodiment of the memory card of FIG. 1;

FIG. 28 is a schematic perspective view illustrating electronic machinesaccording to example embodiments that can be used with the memory cardof FIG. 26;

FIG. 29 is a bottom perspective view illustrating another exampleembodiment of the memory card of FIG. 1;

FIG. 30 is a top perspective view illustrating another exampleembodiment of the memory card of FIG. 1;

FIG. 31 is a bottom perspective view illustrating the memory card ofFIG. 30;

FIG. 32 is a schematic perspective view illustrating electronic machinesaccording to example embodiments that can be used with the memory cardof FIG. 30;

FIG. 33 is a top perspective view illustrating another exampleembodiment of the memory card of FIG. 1;

FIG. 34 is a bottom perspective view illustrating the memory card ofFIG. 33;

FIG. 35 is an exploded perspective view illustrating another exampleembodiment of the memory card of FIG. 1;

FIG. 36 is a schematic perspective view illustrating an electronicmachine according to an example embodiment of inventive concepts;

FIG. 37 is a perspective view illustrating memory cards according toexample embodiments that can be used with the electronic machine of FIG.36;

FIG. 38 is a schematic perspective view illustrating another exampleembodiment of the electronic machine of FIG. 36;

FIG. 39 is a perspective view illustrating an electronic machineaccording to an example embodiment that can be used with the memory cardof FIG. 8;

FIG. 40 is a perspective view illustrating an electronic machineaccording to an example embodiment that can be used with the memory cardof FIG. 14;

FIGS. 41 and 42 are views illustrating memory chips according to exampleembodiments that can be used in the above-described memory cards;

FIG. 43 is a schematic view illustrating a memory card according toexample embodiments provided with a protector;

FIG. 44 is a schematic view illustrating a memory card provided with anauxiliary power supply;

FIG. 45 is a bottom view illustrating a memory card including by-passpads according to an example embodiment;

FIG. 46 is a view illustrating the memory card of FIG. 45 when aprotection cover is removed from the memory card;

FIG. 47 is a sectional view taken along line B-B′ of FIG. 45; and

FIG. 48 is a view for illustrating a structure for selectively using oneof two sets of interconnection terminals of a memory card according toan example embodiment.

DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS

The attached drawings for illustrating example embodiments of inventiveconcepts are referred to in order to gain a sufficient understanding ofinventive concepts, the merits thereof, and objectives accomplished bythe implementation of inventive concepts.

Hereinafter, inventive concepts will be described in detail byexplaining example embodiments with reference to the attached drawings.In the drawings, lengths and sizes of layers and regions may beexaggerated for clarity. Like reference numerals in the drawings denotelike elements.

It will be understood that, although the terms first, second, third etc.may be used herein to describe various elements, these elements shouldnot be limited by these terms. These terms are used to distinguish oneelement from another. Thus, a first element discussed below could betermed a second element without departing from the teachings ofinventive concepts.

It will be understood that when an element, such as a layer, a region,or a substrate, is referred to as being “on,” “connected to” or “coupledto” another element, it may be directly on, connected or coupled to theother element or intervening elements may be present. In contrast, whenan element is referred to as being “directly on,” “directly connectedto” or “directly coupled to” another element or layer, there are nointervening elements or layers present. Like reference numerals refer tolike elements throughout. As used herein, the term “and/or” includes anyand all combinations of one or more of the associated listed items.

The terminology used herein is for the purpose of describing particularexample embodiments only and is not intended to be limiting of inventiveconcepts. As used herein, the singular forms “a,” “an” and “the” areintended to include the plural forms as well, unless the context clearlyindicates otherwise. It will be further understood that the terms“comprises”, “comprising”, “includes” and/or “including”, when used inthis specification, specify the presence of stated features, integers,steps, operations, elements, and/or components, but do not preclude thepresence or addition of one or more other features, integers, steps,operations, elements, components, and/or groups thereof.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which inventive concepts belong. It willbe further understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andwill not be interpreted in an idealized or overly formal sense unlessexpressly so defined herein.

FIGS. 1 and 2 are perspective views illustrating a memory card 200according to an example embodiment of inventive concepts. FIG. 3 is asectional view taken along line A-A′ of FIG. 1. FIG. 1 is a topperspective view illustrating the memory card 200, and FIG. 2 is abottom perspective view illustrating the memory card 200. In the currentexample embodiment, the memory card 200 may use a nonvolatile memory.For example, the nonvolatile memory may be a flash memory.

Referring to FIGS. 1 through 3, the memory card 200 includes a circuitboard 230, a semiconductor chip 232, and a mold member 220. Thesemiconductor chip 232 includes memory chips 234 and a controller chip236. The memory chips 234 and the controller chip 236 may have a stackedstructure. For example, the memory chips 234 may be superimposed on eachother, and the controller chip 236 may be placed on top of the uppermostmemory chip 234. In another example, only one memory chip 234 may beused. In another example, the memory chips 234 may be spaced apart fromthe controller chip 236. The controller chip 236 may be smaller than thememory chips 234.

The circuit board 230 includes passive components (for example, passivecomponents 739 shown in FIG. 17). The passive components may include acapacitor or a register. Interconnection terminals 238 are formed on anouter surface of the circuit board 230 for an electrical connection withan external electronic device (for example, an electronic machine 5100shown in FIG. 36). One of the interconnection terminals 238 closest to afirst lateral side 245 (described later) may be a power interconnectionterminal for input/output (I/O). In addition, conductive traces (notshown) are formed on the circuit board 230 to electrically connect thechips 234 and 236, the interconnection terminals 238, and the passivecomponents. The mold member 220 is provided to cover the top surfaces ofthe semiconductor chip 232 and the circuit board 230 entirely.

When viewed from the outside, the memory card 200 includes a top side241, a bottom side 242, a front side 243, a rear side 244, the firstlateral side 245, and a second lateral side 246. The front side 243 andthe rear side 244 of the memory card 200 are approximately parallel witheach other. In addition, the top side 241 and the bottom side 242 of thememory card 200 are approximately parallel with each other, and the topside 241 and the front side 243 are approximately perpendicular to eachother. The first lateral side 245 and the second lateral side 246 of thememory card 200 are approximately parallel with each other. The firstlateral side 245 is approximately perpendicular to the top side 241 andthe front side 243. That is, the memory card 200 has an approximatelythin parallelepiped shape. When viewed from the top side, a directionparallel with the first lateral side 245 will referred to as a firstdirection 12, and a direction parallel with the front side 243 will bereferred to as a second direction 14. In addition, a directionperpendicular to the first direction 12 and the second direction 14 willbe referred to as third direction 16.

A label (not shown) may be disposed on the top side 241. The label maybe a sticker or printed with ink. At the bottom side 242 of the memorycard 200, the interconnection terminals 238 are exposed. Theinterconnection terminals 238 may be disposed at a region of the bottomside 242 close to the front side 243. The interconnection terminals 238may be arranged along the second direction 14. In addition, theinterconnection terminals 238 may be parallel with the first direction12.

The interconnection terminals 238 are spaced a predetermined distancefrom the front side 243. The predetermined distance may be determined ina manner such that the interconnection terminals 238 may not besuperposed on interconnection terminals of a different memory card (suchas interconnection terminals 5162 of a memory card 5160 of FIG. 37)having a size similar to that of the memory card 200. For example, thedifferent memory card 5160 may be a micro secure digital card havinginterconnection terminals on a region of its bottom side close to itsfront side. In addition, the predetermined distance may be greater thanthe lengths of the interconnection terminals 238. The lengths of theinterconnection terminals 238 may be equal. The interconnectionterminals 238 may be aligned with each other. Alternatively, some of theinterconnection terminals 238 may be longer than the other of theinterconnection terminals 238. In this case, ends of the interconnectionterminals 238 facing the rear side 244 may be aligned with each other.For example, the longer interconnection terminals 238 may be powerterminals.

FIGS. 4 and 5 illustrate a memory card 300. FIG. 4 is a top perspectiveview illustrating the memory card 300, and FIG. 5 is a bottomperspective view illustrating the memory card 300. The memory card 300has a thin parallelepiped shape similar to that of the memory card 200illustrated in FIGS. 1 through 3. Interconnection terminals 338 of thememory card 300 may be similar in position to the interconnectionterminals 238 of the memory card 200 illustrated in FIGS. 1 through 3. Aprotrusion 312 is disposed on a top side 341 of the memory card 300. Theprotrusion 312 may be disposed in a region of the top side 341 close toa rear side 344 of the memory card 300. The protrusion 312 may extend tofirst and second lateral sides 345 and 346. In addition, the protrusion312 may be rounded and convex toward a front side 343. Alternatively,the protrusion 312 may have a rectangular shape when viewed from the topside. Owing to the protrusion 312, a user may hold the memory card 300easily. Relatively thick devices may be disposed on a circuit board ofthe memory card 300 under the protrusion 312.

FIGS. 6 and 7 illustrate a memory card 400. FIG. 6 is a top perspectiveview illustrating the memory card 400, and FIG. 7 is a bottomperspective view illustrating the memory card 400. The memory card 400may have a thin parallelepiped shape similar to that of the memory card200 illustrated in FIGS. 1 through 3. Interconnection terminals 438 ofthe memory card 400 may be similar in position to the interconnectionterminals 238 of the memory card 200 illustrated in FIGS. 1 through 3. Aprotrusion 412, which is similar to the protrusion 312 of the memorycard 300 of FIG. 4, may be disposed on a top side 441 of the memory card400. In addition, the memory card 400 includes a chamfer 461 between afront side 443 and a second lateral side 446, and the chamfer 461becomes distant from a first lateral side 445 as it goes from the frontside 443 to the second lateral side 446. The chamfer 461 may extend fromthe top side 441 to a bottom side 442.

FIGS. 8 through 10 illustrate a memory card 401. FIG. 8 is a topperspective view illustrating the memory card 401, and FIGS. 9 and 10are a front view and a top view of the memory card 401 of FIG. 8,respectively, for illustrating memory chips 434 and a controller chip436 of the memory card 401. The memory card 401 has a shape similar tothat of the memory card 400 illustrated in FIGS. 6 and 7. However, asshown in FIG. 8, a chamfer 461 a is formed from a top side 441 of thememory card 401 to a predetermined depth of the memory card 401. Forexample, the predetermined depth may be half the thickness of the memorycard 401 when the thickness of a protrusion 412 is not included in thethickness of the memory card 401. Alternatively, the predetermined depthmay be smaller than half the thickness of the memory card 401 when thethickness of a protrusion 412 is not included in the thickness of thememory card 401. As shown in FIG. 9, the memory card 401 includes a moldmember 420, a circuit board 430 and passive components 439.

As described above, the controller chip 436 may be smaller than thememory chips 434. In this case, when the memory chips 434 are viewedfrom the top side, the memory chips 434 may be partially overlapped withthe chamfer 461 a, and when the controller chip 436 is viewed from thetop side, the controller chip 436 may be located outside the chamfer 461a. In addition, when the memory chips 434 are viewed from the firstlateral side 445, the memory chips 434 may be overlapped with thechamfer 461 a. Owing to this, the memory chips 434 having a relativelybig size can be disposed in the memory card 401 which includes thechamfer 461 a and has a limited size.

The chamfer (461, 461 a) may prevent reverse insertion when a userinserts the memory card (400, 401) into a socket of an electronicmachine. For example, the memory card 401 of FIG. 8 may be used with anelectronic machine 5300 (refer to FIG. 39) which includes a protrusion5360 (refer to FIG. 39) corresponding to the chamfer 461 a in a socket5320 (refer to FIG. 39).

FIGS. 11 and 12 illustrate a memory card 500. FIG. 11 is a topperspective view illustrating the memory card 500, and FIG. 12 is abottom perspective view illustrating the memory card 500. The memorycard 500 may have a thin parallelepiped shape similar to that of thememory card 200 illustrated in FIGS. 1 through 3. Interconnectionterminals 538 of the memory card 500 may be similar in position to theinterconnection terminals 238 of the memory card 200 illustrated inFIGS. 1 through 3. A protrusion 512, which is similar to the protrusion312 of the memory card 300 of FIG. 4, may be disposed on a top side 541of the memory card 500. However, the protrusion 512 of the memory card500 may be provided on the top side 541 from a region close to a firstlateral side 545 to a region close to a second lateral side 546. Achamfer 561, which is similar to the chamfer 461 of the memory card 400of FIG. 6, may be provided at a corner of the memory card 500. Inaddition, the memory card 500 includes a notch 562 in a second lateralside 546. The notch 562 may be disposed approximately at the center ofthe second lateral side 546. The notch 562 may extend from a top side541 to a bottom side 542 of the memory card 500. Alternatively, thenotch 562 may be formed in the first lateral side 545, or notches may beformed in the first and second lateral sides 545 and 546, respectively.

FIG. 13 illustrates a memory card 501. FIG. 13 is a top view of thememory card 501. The memory card 501 has a shape similar to the shape ofthe memory card 500 illustrated in FIGS. 11 and 12. However, a notch 562a is formed from a top side 541 to a predetermined depth of the memorycard 501. For example, the predetermined depth may be half the thicknessof the memory card 501 when the thickness of a protrusion 512 is notincluded in the thickness of the memory card 501. Alternatively, thepredetermined depth may be smaller than half the thickness of the memorycard 501 when the thickness of the protrusion 512 is not included in thethickness of the memory card 501.

Although not shown in FIG. 13, in the memory card 501, memory chips maybe partially overlapped with the notch 562 a when the memory chips areviewed from the top side, and a controller chip may be located outsidethe notch 562 a when the controller chip is viewed from the top side. Inaddition, when the controller chip is viewed from a second lateral side546′, the controller chip may be partially overlapped with the notch 562a.

FIGS. 14 to 17 illustrate a memory card 700. FIG. 14 is a topperspective view illustrating the memory card 700, and FIG. 15 is abottom perspective view illustrating the memory card 700. In addition,FIGS. 16 and 17 are a front view and a top view of the memory card 700for illustrating memory chips 734 and a controller chip 736. The memorycard 700 may have a thin parallelepiped shape similar to that of thememory card 200 illustrated in FIGS. 1 through 3. Interconnectionterminals 738 of the memory card 700 may be similar in position to theinterconnection terminals 238 of the memory card 200 illustrated inFIGS. 1 through 3. A protrusion 712, which is similar to the protrusion312 of the memory card 300 of FIG. 4, may be disposed on a top side 741of the memory card 700. A first groove 763 may be formed in a region ofthe top side 741 of the memory card 700 close to a first lateral side745, and a second groove 764 may be formed in a region of the top side741 close to a second lateral side 746. The longitudinal direction ofthe first groove 763 may be parallel to the first direction 12. Thefirst groove 763 may have a constant width G_(W1) in its longitudinaldirection. An end of the first groove 763 may extend to a front side 743of the memory card 700. A length G_(L1) of the first and second grooves763, 764 may be about ¼ to about ¾ a length C_(L) of the memory card700. For example, the length G_(L1) may be about ½ the length C_(L) ofthe memory card 700. In addition, a lateral side of the first groove 763may extend to the first lateral side 745. The width G_(W1) of the firstgroove 763 may be about 1/20 to about 1/10 of the width C_(W) of thememory card 700. For example, the width G_(W1) of the first groove 763may be about 1/12 the width C_(W) of the memory card 700. The firstgroove 763 may extend from the top side 741 of the 700 to apredetermined depth. For example, the predetermined depth may be about ½the thickness of the memory card 700. The first and second grooves 763and 764 may be symmetric with respect to an imaginary line 18 passingthrough the center of the memory card 700 and approximately parallelwith the first lateral side 745.

As described above, the controller chip 736 may be smaller than thememory chips 734. In this case, when the memory chips 734 are viewedfrom the top side, the memory chips 734 may be partially overlapped withthe grooves 763 and 764, and when the controller chip 736 is viewed fromthe top side, the controller chip 736 may be disposed outside thegrooves 763 and 764. In addition, when the controller chip 736 is viewedfrom the first lateral side 745, the controller chip 736 may bepartially overlapped with the grooves 763 and 764. The memory chips 734having a relatively big size can be disposed in the memory card 700although the memory card 700 includes the grooves 763 and 764 and has alimited size.

Alternatively, only one of the first and second grooves 763 and 764 maybe formed in the memory card 700. In addition, the first and secondgrooves 763 and 764 may extend from the top side 741 to a bottom side742 of the memory card 700.

In the above example, ends of the grooves 763 and 764 extend to thefront side 743, and the other ends of the grooves 763 and 764 extend topositions spaced apart from a rear side 744. However, alternatively,ends of the grooves 763 and 764 may extend to the front side 743, andthe other ends of the grooves 763 and 764 may extend to the rear side744.

Furthermore, in the above example, outer sides of the grooves 763 and764 extend to the first lateral side 745 and the second lateral side746. However, alternatively, the outer sides of the grooves 763 and 764may extend to positions spaced inward from the first lateral side 745and the second lateral side 746.

Grooves 763 and 764 may prevent reverse insertion when a user insertsthe memory card 700 into a socket of an electronic machine. For example,the memory card 700 of FIG. 14 may be used with an electronic machine5400 (refer to FIG. 40) which includes protrusions 5460 (refer to FIG.40) corresponding to the grooves 763 and 764 in a socket 5420 (refer toFIG. 40). As shown in FIG. 16, the memory card 700 also includes a moldmember 720 and a circuit board 730.

FIGS. 18 and 19 illustrate a memory card 800. FIG. 18 is a topperspective view illustrating the memory card 800, and FIG. 19 is abottom perspective view illustrating the memory card 800. The memorycard 800 may have a thin parallelepiped shape similar to that of thememory card 200 illustrated in FIGS. 1 through 3. Interconnectionterminals 838 of the memory card 800 may be similar in position to theinterconnection terminals 238 of the memory card 200 illustrated inFIGS. 1 through 3. A protrusion 812, which is similar to the protrusion312 of the memory card 300 of FIG. 4, may be disposed on a top side 841of the memory card 800. First and second grooves 863 and 864 may beformed in both lateral sides 845, 846 of the memory card 800 like thefirst and second grooves 763 and 764 of the memory card 700 illustratedin FIGS. 14 and 15. In addition, a first notch 865 may be formed in afirst lateral side 845. The length G_(L2) of the first groove 863 of thememory card 800 may be smaller than that of the first groove 763 of thememory card 700 illustrated in FIGS. 14 and 15. The first groove 863 mayextend to a front side 843, and the length G_(L2) of the first groove863 may be shorter than about ½ the length C_(L) of the memory card 800.For example, the length G_(L2) of the first groove 863 may be about ¼ toabout ⅜ the length C_(L) of the memory card 800. The first notch 865 maybe disposed at a center part of the first lateral side 845 of the memorycard 800. A width N_(W) of the first notch 865 may be equal to a widthG_(W2) of the first groove 863. The length N_(L) of the first notch 865may be about ⅛ to about ⅙ the length G_(L2) of the first groove 863. Thefirst notch 865 may extend from the top side 841 to a predetermineddepth. For example, the thickness N_(T) of the first notch 865 may beequal to the thickness G_(T) of the first groove 863. For example, thepredetermined depth of the first lateral side 845 may be about ½ thethickness of the memory card 800 not including the thickness of theprotrusion 812. In addition, a second groove 864 and a second notch 866may be formed in a second lateral side 864. The second lateral side 864and the second notch 866 are symmetric to the first groove 863 and thefirst notch 865 with respect to an imaginary line 18 passing through thecenter of the memory card 800 and approximately parallel with the firstlateral side 845. The first notch 865 is spaced a predetermined distancefrom the first groove 863 in the first direction 12.

Alternatively, only one of the first and second grooves 863 and 864 maybe formed in the memory card 800. In addition, the first and secondgrooves 863 and 864 may extend from the top side 841 to a bottom side842 of the memory card 800. In addition, only one of the first andsecond notches 865 and 866 may be formed in the memory card 800. Theprotrusion 812 may not be provided on the top side 841 of the memorycard 800. In addition, the first notch 865 may extend from the top side841 to the bottom side 842 of the memory card 800.

FIGS. 20 and 21 illustrate a memory card 900. FIG. 20 is a topperspective view illustrating the memory card 900, and FIG. 21 is abottom perspective view illustrating the memory card 900. The memorycard 900 may have a thin parallelepiped shape similar to that of thememory card 200 illustrated in FIGS. 1 through 3. Interconnectionterminals 938 of the memory card 900 may be similar in position to theinterconnection terminals 238 of the memory card 200 illustrated inFIGS. 1 through 3. A protrusion 912, which is similar to the protrusion312 of the memory card 300 of FIG. 4, may be disposed on a top side 941of the memory card 900. First and second grooves 963 and 964 may beformed in both lateral sides 945 and 946 of the memory card 900 like thefirst and second grooves 763 and 764 of the memory card 700 illustratedin FIGS. 14 and 15. In addition, a chamfer 961, which is similar to thechamfer 461 of the memory card 400 of FIG. 6, may be provided at acorner of the memory card 900. Alternatively, the chamfer 961 may besimilar to the chamfer 461 a of FIG. 8.

FIGS. 22 and 23 illustrate a memory card 1000. FIG. 22 is a topperspective view illustrating the memory card 1000, and FIG. 23 is abottom perspective view illustrating the memory card 1000 including abottom side 1042. The memory card 1000 may have a thin parallelepipedshape similar to that of the memory card 200 illustrated in FIGS. 1through 3. Interconnection terminals 1038 of the memory card 1000 may besimilar in position to the interconnection terminals 238 of the memorycard 200 illustrated in FIGS. 1 through 3. A protrusion 1012, which issimilar to the protrusion 312 of the memory card 300 of FIG. 4, may bedisposed on a top side 1041 of the memory card 1000. In addition, achamfer 1061, which is similar to the chamfer 461 of the memory card 400of FIG. 6, may be provided at a corner of the memory card 1000. A groove1063 may be formed in a first lateral side 1045 of the memory card 1000like the first groove 763 of the memory card 700 illustrated in FIGS. 14and 15. A notch 1066 may be formed in a second lateral side 1046 of thememory card 1000 like the second notch 562 of the memory card 500illustrated in FIG. 11.

FIG. 24 illustrates a memory card 1100. FIG. 24 is a bottom perspectiveview illustrating the memory card 1100. The memory card 1100 may have athin parallelepiped shape similar to that of the memory card 200illustrated in FIGS. 1 through 3. The memory card 1100 includesinterconnection terminals 1138, and one or more interconnectionterminals 1138 a of the interconnection terminals 1138 may be longerthan other terminals 1138 b. For example, the interconnection terminal1138 a may be a power terminal which is two or more times longer thanthe other terminals 1138 b. Ends of the interconnection terminals 1138facing a rear side 1144 may be arranged along the same line, and theother end of the power terminal 1138 a may be closer to a front side1143 than the other ends of the other terminals 1138 b. For example, theinterconnection terminal 1138 a may be a power terminal 1138 a. Inanother example, a plurality of interconnection terminals 1138 a may beprovided, and the interconnection terminals 1138 a may be powerterminals.

FIG. 25 illustrates a memory card 1200. FIG. 25 is a bottom perspectiveview illustrating the memory card 1200. The memory card 1200 may have athin parallelepiped shape similar to that of the memory card 200illustrated in FIGS. 1 through 3. A protection region 1242 b may beprovided on a bottom side 1242 of the memory card 1200 between a frontside 1243 and interconnection terminals 1238. The protection region 1242b may be formed of a material different from a material used to formanother region 1242 a of the bottom side 1242. The protection region1242 b may be formed of a material that causes less damage tointerconnection terminals of an electronic machine (such asinterconnection terminals 5140 b of the electronic machine 5100 of FIG.36) when the memory card 1200 makes contact with the interconnectionterminals 5140 b, as compared with a material used to form the otherregion 1242 a. The protection region 1242 b may have an approximatelyrectangular shape. The longitudinal direction of the protection region1242 b may be parallel with the second direction 14. A length P_(L) ofthe protection region 1242 b may be sufficiently large to cover a widthT_(W) of the interconnection terminals 1238. For example, the protectionregion 1242 b may extend from a position close to a first lateral side1245 to a position close to a second lateral side 1246. Alternatively,the protection region 1242 b may extend from the first lateral side 1245to the second lateral side 1246. The width P_(W) of the protectionregion 1242 b may be greater than the lengths of the respectiveinterconnection terminals 1238. The protection region 1242 b may bedisposed at a position corresponding to interconnection terminals of adifferent memory card (such as the interconnection terminals 5162 of thememory card 5160 of FIG. 37) having a size similar to that of the memorycard 1200 of the current embodiment. For example, the different memorycard 5160 may be the above-described micro secure digital card.

In the above-described examples, the interconnection terminals arearranged on the bottom side of the memory card close to the front sideof the memory card in parallel to the second direction 14. However, theinterconnection terminals may be arranged on the bottom side of thememory card close to the rear side of the memory card. In addition, theinterconnection terminals may not be parallel with the second direction14. In addition, the interconnection terminals may be arranged on thetop side of the memory card.

FIG. 26 is a perspective view illustrating a memory card 1300 accordingto another example embodiment of inventive concepts. FIG. 26 is a bottomperspective view illustrating the memory card 1300. The memory card 1300may have a thin parallelepiped shape similar to that of the memory card200 illustrated in FIGS. 1 through 3. The memory card 1300 includes aplurality of sets of interconnection terminals 1338. For example, thememory card 1300 may include two sets of interconnection terminals 1338.For example, interconnection terminals 1338 of the memory card 1300corresponding to the interconnection terminals 238 of the memory card200 illustrated in FIGS. 1 through 3 will now be referred to as a firstset of interconnection terminals 1338 a, and the other interconnectionterminals 1338 will be referred to a second set of interconnectionterminals 1338 b.

The number of the first set of interconnection terminals 1338 a may bedifferent from the number of the second set of interconnection terminals1338 b. For example, the number of the first set of interconnectionterminals 1338 a may be nine, and the number of the second set ofinterconnection terminals 1338 b may be eight. In this case, the firstset of interconnection terminals 1338 a may further include a pindedicated for I/O. The pin dedicated for I/O may be closest to a firstlateral side. Alternatively, the number of the first set ofinterconnection terminals 1338 a may be equal to the number of thesecond set of interconnection terminals 1338 b.

The second set of interconnection terminals 1338 b is disposed between afront side 1343 and the first set of interconnection terminals 1338 a.For example, the region where the second set of interconnectionterminals 1338 b are disposed may correspond to a region whereinterconnection terminals of a different memory card (such as theinterconnection terminals 5162 of the memory card 5160 of FIG. 37)having a size similar to that of the memory card 1300 are disposed. Forexample, the different memory card 5160 may be the above-described microsecure digital card. The number of the second set of interconnectionterminals 1338 b may be equal to the number of the first set ofinterconnection terminals 1338 a, and the second set of interconnectionterminals 1338 b may be arranged in the same intervals as the first setof interconnection terminals 1338 a. In this case, the second set ofinterconnection terminals 1338 b may be aligned with the first set ofinterconnection terminals 1338 a, respectively, as shown in FIG. 26.Alternatively, interconnection terminals 1438 may be staggered. Forexample, a first set of interconnection terminals 1438 a and a secondset of interconnection terminals 1438 b of a memory card 1400 may bestaggered, as shown in FIG. 27.

The first set of interconnection terminals 1338 a and the second set ofinterconnection terminals 1338 b may be used for different electronicmachines. The first set of interconnection terminals 1338 a may beinserted into a socket of a first electronic machine for electricconnection with the first electronic machine, and the second set ofinterconnection terminals 1338 b may be inserted into a socket of asecond electronic machine for electric connection with the secondelectronic machine.

The first and second electronic machines may be used for differentpurposes. Each of the first and second electronic machines may include asocket into which a memory card can be fully inserted. The first andsecond electronic machines may be used with different memory cards, andthe number, sizes, and arrangement of interconnection terminals providedat the socket of the first electronic machine may be different from thenumber, sizes, and arrangement of interconnection terminals provided atthe socket of the second electronic machine.

FIG. 28 illustrates an example first electronic machine 2100 and anexample second electronic machine 2200. The first electronic machine2100 may be one of devices such as a computer, a digital camera, adigital camcorder, a cellular phone, and a personal digital assistant(PDA), and the second electronic machine 2200 may be another of thedevices. Alternatively, the first and second electronic machines 2100and 2200 may be the same kind of electronic machines. For example, thefirst and second electronic machines 2100 and 2200 may be cellularphones.

The first and second electronic machines 2100 and 2200 may includesockets 2120 and 2220 having similar sizes. Interconnection terminals2140 and 2240 are provided at the sockets 2120 and 2220 for electricconnection with external memory cards (such as the memory card 1300illustrated in FIG. 26). For example, the interconnection terminals 2140and 2240 may be provided at the bottom sides of the sockets 2120 and2220. The distance between the interconnection terminals 2140 of thesocket 2120 and an inlet 2122 of the socket 2120 of the first electronicmachine 2100 is shorter than the distance between the interconnectionterminals 2240 of the socket 2220 and an inlet 2222 of the socket 2220of the second electronic machine 2200. In this case, if the memory card1300 (refer to FIG. 26) is inserted into the socket 2120 of the firstelectronic machine 2100, the first set of interconnection terminals 1338a is electrically connected to the interconnection terminals 2140 of thefirst electronic machine 2100. In addition, if the memory card 1300(refer to FIG. 26) is inserted into the socket 2220 of the secondelectronic machine 2200, the second set of interconnection terminals1338 b is electrically connected to the interconnection terminals 2240of the second electronic machine 2200.

FIG. 29 illustrates another example memory card 1500. FIG. 29 is abottom perspective view illustrating the memory card 1500. The memorycard 1500 may have a thin parallelepiped shape similar to that of thememory card 200 illustrated in FIGS. 1 through 3. The memory card 1500includes a plurality of interconnection terminals 1538 a and 1538 b. Forexample, the memory card 1500 may include a first set of interconnectionterminals 1538 a and a second set of interconnection terminals 1538 b.The first set of interconnection terminals 1538 a of the memory card1500 may be disposed in a region of a bottom side 1542 close to a rearside 1544 of the memory card 1500. The second set of interconnectionterminals 1538 b of the memory card 1500 may be disposed in a region ofthe bottom side 1542 close to a front side 1543 of the memory card 1500.

FIGS. 30 and 31 illustrate a memory card 1600. FIG. 30 is a topperspective view illustrating the memory card 1600, and FIG. 31 is abottom perspective view illustrating the memory card 1600. The memorycard 1600 may have a thin parallelepiped shape similar to that of thememory card 200 illustrated in FIGS. 1 through 3. The memory card 1600includes a plurality of interconnection terminals 1638 a and 1638 b. Forexample, the memory card 1600 may include first and second sets ofinterconnection terminals 1638 a and 1638 b. The first set ofinterconnection terminals 1638 a may be disposed on a top side 1641 ofthe memory card 1600, and the second set of interconnection terminals1638 b may be disposed on a bottom side 1642 of the memory card 1600.For example, the first set of interconnection terminals 1638 a may bedisposed in a region of the top side 1641 close to a front side 1643 ofthe memory card 1600, and the second set of interconnection terminals1638 b may be disposed in a region of the bottom side 1642 close to thefront side 1643 of the memory card 1600.

In the memory card 1300, 1400, 1500, and 1600 of FIGS. 26, 27, 29 and30, one set of the first set of interconnection terminals 1338 a, 1438a, 1538 a and 1638 a and the second set of interconnection terminals1338 b, 1438 b, 1538 b and 1638 b may be covered with a protectionlayer. The protection layer may be solder resist or other material. Forexample the protection layer may be epoxy compound or epoxy tape.

Referring to FIG. 32, a first electronic machine 3100 includes a socket3120, and interconnection terminals 3140 are provided on a top side ofthe socket 3120. A second electronic machine 3200 includes a socket3220, and interconnection terminals 3240 are provided on a bottom sideof the socket 3220. The memory card 1600 can be used with both the firstelectronic machine 3100 and the second electronic machine 3200.

In the above-described examples, the memory cards illustrated in FIGS.25, 26, 27, 29, and 30 have a shape similar to that of the memory cardillustrated in FIGS. 1 through 3. However, the memory cards may have ashape similar to any one of the shapes of the memory cards illustratedin FIGS. 4, 6, 8, 11, 13, 14, 18, 20, and 22. That is, the memory cardsillustrated in FIGS. 25, 26, 27, 29, and 30 may include one or more ofthe protrusion 312 or 612, the chamfer 461 or 461 a, the notch 562, 562a, 865, 866, or 1066, the first groove 763 or 863, and the second groove764 or 864.

FIGS. 33 and 34 illustrate a memory card 1700. FIG. 33 is a topperspective view illustrating the memory card 1700, and FIG. 34 is abottom perspective view illustrating the memory card 1700. The memorycard 1700 may have a thin parallelepiped shape similar to that of thememory card 300 illustrated in FIGS. 4 and 5. However, a convex part1758 and a concave part 1759 are disposed on a second lateral side 1746(opposite a first lateral side 1745) of the memory card 1700. The convexpart 1758 may be disposed close to the concave part 1759. The convexpart 1758 may be closer to a front side 1743 than the concave part 1759.As shown, the memory card 1700 includes a top side 1741 and a protrusion1712.

FIG. 35 is an exploded perspective view illustrating another examplememory card 1800. In the above-described examples, it has explained thatthe memory cards 200 through 1700 are fabricated in a way of enclosing acircuit board on which semiconductor chips are mounted by a moldingmethod. However, instead of this, the memory card 1800 may be fabricatedby inserting a circuit board 1830 on which semiconductor chips 1834 and1836 (e.g., controller and memory chips) are mounted in a case 1801. Forexample, the case 1801 includes an upper cover 1810 and a lower cover1820. The upper cover 1810 faces the top side of the circuit board 1830,and the lower cover 1820 faces the bottom side of the circuit board1830. When the upper cover 1810 and the lower cover 1820 are coupled, anaccommodation space is formed inside the upper cover 1810 and the lowercover 1820 so that the circuit board 1830 can be accommodated. The lowercover 1820 is shaped in a manner such that interconnection terminals1838 of the circuit board 1830 can be exposed to the outside of the case1801. For example, openings 1822 having sizes and shapes correspondingto those of the interconnection terminals 1838 may be formed in thelower cover 1820 at positions corresponding to the positions of theinterconnection terminals 1838 of the circuit board 1830.

FIG. 36 is a perspective view illustrating an electronic machine 5100according to an example embodiment of inventive concepts. The electronicmachine 5100 may be electrically connected with an external memory card(such as a memory card 5150 or 5160 illustrated in FIG. 37) for storingdata such as photo data, voice data, video data, or other information inthe memory card 5150 or 5160 and reading such data from the memory card5150 or 5160. For example, the electronic machine 5100 may be acomputer, a digital camera, a digital camcorder, a cellular phone, or aPDA. The electronic machine 5100 includes a body and a socket 5120.

The socket 5120 may be provided at the outer side of the body so thatthe socket 5120 can be directly exposed to the outside of the electronicmachine 5100. An inlet 5122 of the socket 5120 may be closed or openedby a cover (not shown) provided at the body. The socket 5120 includes anaccommodation space for receiving the memory card 5150 or 5160. Forexample, the accommodation space may have a sufficient volume to receivethe memory card 5150 or 5160 fully.

The socket 5120 includes a plurality of sets of interconnectionterminals 5140. For example, the socket 5120 may include first andsecond sets of interconnection terminals 5140 a and 5140 b. The firstset of interconnection terminals 5140 a and the second set ofinterconnection terminals 5140 b may be electrically connected withdifferent kinds of memory cards. For example, the first set ofinterconnection terminals 5140 a are disposed at positions such thatwhen the (first) memory card 5150 is inserted into the accommodationspace of the socket 5120, the first set of interconnection terminals5140 a can be electrically connected to interconnection terminals 5152of the first memory card 5150; the second set of interconnectionterminals 5140 b are disposed at positions such that when the (second)memory card 5160 is inserted into the accommodation space of the socket5120, the second set of interconnection terminals 5140 b can beelectrically connected to interconnection terminals 5162 of the secondmemory card 5160. The number, sizes, and arrangement of theinterconnection terminals 5152 of the first memory card 5150 aredifferent from the number, sizes, and arrangement of the interconnectionterminals 5162 of the second memory card 5160.

For example, the first set of interconnection terminals 5140 a and thesecond set of interconnection terminals 5140 b are provided on a bottomside of the accommodation space of the socket 5120. The first set ofinterconnection terminals 5140 a and the second set of interconnectionterminals 5140 b may be arranged in the same direction. The first set ofinterconnection terminals 5140 a may be closer to the inlet 5122 thanthe second set of interconnection terminals 5140 b.

FIG. 37 illustrates an example usage of the electronic machine 5100 withthe memory cards 5150 and 5160. For example, the second memory card 5160may be the above-described micro secure digital card, and the firstmemory card 5150 may be a different kind of memory card. The firstmemory card 5150 may be an existing memory card or a new kind of memorycard. For example, the first memory card 5150 may be the memory cardillustrated in FIG. 1, 4, 6, 8, 11, 13, 14, 18, 20, or 22. When thememory card 5150 is inserted in the accommodation space, the first setof interconnection terminals 5140 a of the socket 5120 of the electronicmachine 5100 are electrically connected to the interconnection terminals5152 of the first memory card 5150. In addition, when the second memorycard 5160 is inserted in the accommodation space, the second set ofinterconnection terminals 5140 b of the socket 5120 of the electronicmachine 5100 are electrically connected to the interconnection terminals5162 of the second memory card 5160. The first memory card 5150 may belarger than the second memory card 5160. Selectively the first memorycard 5150 may be same size with the second memory card 5160.

FIG. 38 illustrates another electronic machine 5200 including aplurality of interconnection terminals 5240. The electronic machine 5200is similar to the electronic machine 5100 of FIG. 36. However, a firstset of interconnection terminals 5240 a is disposed on a top side of anaccommodation space of a socket 5220, and a second set ofinterconnection terminals 5240 b is disposed on a bottom side of theaccommodation space of the socket 5220. As shown, the socket 5220includes an inlet 5222.

FIGS. 41 and 42 illustrate example three-dimensional (3D) memory chipsthat can be used in the above-described memory cards. The memory chipsof FIGS. 41 and 42 are examples of memory devices disclosed in KoreanPatent Application Publication Nos. 2009-93770 and 2007-96972, theentire contents of which are hereby incorporated by reference. Thememory chips of the above-described embodiments may be vertical typememory devices disclosed in Korean Patent Application Publication No.2009-93770 or nonvolatile semiconductor memory devices disclosed inKorean Patent Application Publication No. 2007-96972.

The memory cards of the above-described example embodiments may furtherinclude a protector to protect semiconductor chips from electrostaticdischarge (ESD). FIG. 43 is a schematic view illustrating a memory cardprovided with a protector. In detail, FIG. 43 illustrates the case wherea protector 280 is included in a memory card 200′. The memory card 200′is the same as the memory card 200 except that the memory card 200′includes the protector 280. It should be understood that the memory card200′ may be used in example embodiments instead of the memory card 200.Such a protector may be included in the memory cards of other exampleembodiments. Referring to FIG. 43, the protector 280 includes groundterminals 281, a protective pattern 282, and switching devices 283. Thecircuit board 230 may be divided into a first region, a second region,and a third region. The semiconductor chip 232 is mounted in the firstregion, and the ground terminals 281 are disposed in the second region.The protective pattern 282 is disposed in the third region to protectthe semiconductor chip 232. For example, the first region may be acenter region of the circuit board 230, the second region may be a sideof the center region, and the third region may be a region disposedaround the first region except for the second region.

Ends of the ground terminals 281 are connected to an external groundpart, and the other ends of the ground terminals 281 are connected tothe protective pattern 282. The ground terminals 281 may be connected tothe ground part or the ground terminals 281 directly or through aconductive pattern. The number of the ground terminals 281 may be two,and both ends of the protective pattern 282 may be connected to theground terminals 281, respectively. Although two ground terminals 281are illustrated, the number of the ground terminals 281 may be changed.The ground terminals 281 may be formed of a conductive material. Theconductive material may include a metal or metal compound. For example,the conductive material may be copper or a copper compound.

The protective pattern 282 is formed in the second region of the circuitboard 230 and spaced a predetermined distance from the semiconductorchip 232. The protective pattern 282 is connected to the groundterminals 281. In the case where two ground terminals 281 are used, bothends of the protective pattern 282 may be connected to the groundterminals 281, respectively, in a loop shape surrounding thesemiconductor chip 232. The protective pattern 282 may be formed of aconductive material. The conductive material may include a metal ormetal compound. For example, the conductive material may be copper or acopper compound.

The switching devices 283 are connected in series between the groundterminals 281 and the protective pattern 282. For example, the switchingdevices 283 may be formed on the protective pattern 282 as shown in FIG.43. In another example, the switching devices 283 may be directlyconnected to the ground terminals 281. In the current embodiment, thenumber of the switching devices 283 is two, and the ground terminals 281are connected to both ends of the ground terminals 281 through theswitching devices 283, respectively. Although two switching devices 283are illustrated, the number of the switching devices 283 may be changed.In addition, the switching devices 283 may be disposed close to theground terminals 281 to minimize the distances between the switchingdevices 283 and the ground terminals 281. In this case, when a sparkgenerates in a high voltage state such as an electrostatic dischargestate, a high-voltage current can rapidly flow to the ground terminals281 through the protective pattern 282. The switching devices 283 mayinclude one of a zener diode, an inductor, and a variable resistor(varistor).

The memory cards of the above-described example embodiments may furtherinclude an auxiliary power supply 6101 for stably performing a suddenpower-off operation such as a data backup operation when a suddenpower-off event occurs. FIG. 44 illustrates an example memory cardincluding the auxiliary power supply 1601. Referring to FIG. 44, theauxiliary power supply 1601 includes a first super capacitor 6111, asecond super capacitor 6112, a charging circuit 6120, a switch 6130, avoltage detector 6140, and a control circuit 6150.

The first and second super capacitors 6111 and 6112 may be power storagedevices that can store high-capacity charges. The first and second supercapacitors 6111 and 6112 may be charged when the memory card is poweredup or operates in a normal state. The charges stored in the first andsecond super capacitors 6111 and 6112 may be supplied to an internalcircuit 6102 as auxiliary power. The capacitances of the first andsecond super capacitors 6111 and 6112 may be decreased according totime. If the first super capacitor 6111 cannot be used due to a decreaseof its capacitance, the sudden power-off operation of the memory cardmay be poorly carried out. In this case, the second super capacitor 6112may supply auxiliary power, and thus the sudden power-off operation ofthe memory card may be normally carried out.

The auxiliary power of the first and second super capacitors 6111 and6112 may be sequentially supplied. That is, if the first super capacitor6111 cannot be used due to degradation, the second super capacitor 6112is used. A ground circuit GND may be connected to the second supercapacitor 6112. The ground circuit GND is used to discharge the secondsuper capacitor 6112 while the first super capacitor 6111 is used. Thecharging circuit 6120 is used to charge the first super capacitor 6111and the second super capacitor 6112. The charging circuit 6120 mayinclude an internal power supply (not shown). In this case, the chargingcircuit 6120 may charge the first and second super capacitors 6111 and6112 by using the internal power supply.

Alternatively, the charging circuit 6120 may charge the first and secondsuper capacitors 6111 and 6112 by using power supplied from an externalpower supply (not shown). The charging circuit 6120 may supply acharging current to the first and second super capacitors 6111 and 6112through a charging path {circle around (1)}. The switch 6130 isconnected between the second super capacitor 6112 and the chargingcircuit 6120. The switch 6130 may be used to control supply of acharging current to the second super capacitor 6112. That is, when theswitch 6130 is turned on, a charging current is supplied to the secondsuper capacitor 6112, and when the switch 6130 is turned off, a chargingcurrent is not supplied to the second super capacitor 6112. In addition,the switch 6130 may be used to control discharging of the second supercapacitor 6112. That is, if the switch 6130 is turned on, a dischargingcurrent is supplied from the second super capacitor 6112, and if theswitch 6130 is turned off, a discharging current is not supplied fromthe second super capacitor 6112. The first and second super capacitors6111 and 6112 may supply a discharging current through a dischargingpath {circle around (2)}.

The voltage detector 6140 may detect charging voltages or dischargingvoltages of the first and second super capacitors 6111 and 6112. Thevoltage detector 6140 may detect a charging voltage or a dischargingvoltage by measuring the voltage of an N node when the first supercapacitor 6111 or the second super capacitor 6112 is charged ordischarged.

The control circuit 6150 controls the ground circuit GND, the chargingcircuit 6120, the switch 6130, and the voltage detector 6140. While thefirst super capacitor 6111 is used, the control circuit 6150 controlsthe ground circuit GND so that the second super capacitor 6112 isdischarged. In addition, the control circuit 6150 controls the chargingcircuit 6120 so that a charging current is supplied to the first andsecond super capacitors 6111 and 6112. The control circuit 6150 cancontrol the switch 6130 so as not to use the second super capacitor6112. For example, if the capacitance of the first super capacitor 6111is sufficient, the second super capacitor 6112 may be not used under thecontrol of the control circuit 6150. When the second super capacitor6112 is not used, a charge unnecessarily stored in the second supercapacitor 6112 may be completely discharged through the ground circuitGND under the control of the control circuit 6150. The control circuit6150 may calculate an equivalent series resistance ESR from a chargingvoltage or a discharging voltage received from the voltage detector6140. The ESR is a resistance component from the N node to the firstsuper capacitor 6111 or the second super capacitor 6112. When a chargingcurrent is supplied to the first super capacitor 6111, the voltage ofthe N node is steeply increased for a predetermined time due to the ESR.The ESR can be calculated by using a charging current Ic and an N nodevoltage Vn.

The control circuit 6150 may receive a charging or discharging voltagefrom the voltage detector 6140 for calculating the capacitance of thefirst super capacitor 6111 or the second super capacitor 6112. Forexample, the control circuit 6150 may calculate a capacitance Cs1 of thefirst super capacitor 6111 from a charging current, a charging time, andthe N node voltage Vn. The control circuit 6150 may include an internaltimer (not shown) to count a charging time. The control circuit 6150 maydetermine the time when the switch 6130 is turned on by using an ESR andthe capacitance of the first super capacitor 6111 or the second supercapacitor 6112.

The memory cards of the above-described example embodiments may furtherinclude a by-pass pad. The by-pass pad may be electrically connected toa memory chip. An operator may test the electric characteristics of thememory chip through the by-pass pad. FIGS. 45 through 47 illustrate anexample memory card 2000 including by-pass pads 2040. FIG. 45 is abottom view of the memory card 2000. FIG. 46 is a view illustrating thememory card 2000 when a protection cover 2044 is removed from the memorycard 2000, and FIG. 47 is a sectional view taken along line B-B′ of FIG.45.

Referring to FIGS. 45 through 47, the memory card 2000 may have a thinparallelepiped shape similar to that of the memory card 200 illustratedin FIGS. 1 through 3. Interconnection terminals 2038 of the memory card2000 may be similar in position to the interconnection terminals 238 ofthe memory card 200 illustrated in FIGS. 1 through 3. A controller chip2036 and memory chips 2034 may be mounted on a circuit board 2030 in amanner such that the controller chip 2036 is spaced apart from thememory chips 2034 in a horizontal direction. Alternatively, thecontroller chip 2036 may be disposed on the memory chips 2034 like thecase of the memory card 200 illustrated in FIGS. 1 through 3. Aninterconnection line 2039 may be formed in the circuit board 2030, andthe controller chip 2036 and the memory chips 2034 may be connected toeach other through the interconnection line 2039 and wires 2048. Theby-pass pads 2040 are provided on the bottom side of the circuit board2030. By-pass pads 2040 are connected to by-pass lines 2042 extendingfrom the interconnection line 2039. If the memory card 2000 operatesabnormally, an operator can test functions of the memory card 2000through the by-pass pads 2040 for checking errors of the memory card2000.

In addition, a protection cover 2044 may be provided so that the by-passpads 2040 cannot be exposed to the outside of the memory card 2000. Theprotection cover 2044 covers the by-pass pads 2040. The protection cover2044 may be provided in the form of an insulating layer. For example,the protection cover 2044 may be formed of solder resist. That is, thebottom side of the circuit board 2030 may be coated with solder resistso that all the by-pass pads 2040 can be covered. If it is necessary totest the memory card 2000, an operator can perform a test after exposingthe by-pass pads 2040 by removing the solder resist through etching orpolishing. The protection cover 2044 may be an insulating layer formedof an insulating material that can be easily removed by a selectiveetching process. For example, the protection cover 2044 may be formed ofan epoxy based polymer. Alternatively, the protection cover 2044 may beformed of a capsulation material. Alternatively, the protection cover2044 may be formed of an insulating tape.

FIG. 48 illustrates an example structure for selectively using one oftwo sets of interconnection terminals in a memory card such as thememory cards illustrated in FIGS. 26, 29, 30, and 31. FIG. 48 is aschematic bottom view of the memory card. The memory card of FIG. 48 hasa structure similar to that of the memory card 1300 illustrated in FIG.26. In the memory card, data received from or to be stored in a memorychip are transmitted or received through first interconnection terminals2138 a or second interconnection terminals 2138 b by using an outputsignal Tx or an input signal Rx of a controller chip 2136. Only onecontroller chip 2136 may be mounted on a circuit board 2130. Firstcapacitor pads 2171 and second capacitor pads 2172 may be disposedbetween the controller chip 2136 and the first interconnection terminals2138 a.

The first capacitor pads 2171 are provided for electric connectionbetween the controller chip 2136 and the first interconnection terminals2138 a. The first capacitor pads 2171 include first pads 2171 a andsecond pads 2171 b. The first and second pads 2171 a and 2171 b arespaced a predetermined distance from each other and are disposed to faceeach other. First signal lines 2162 and second signal lines 2163 areformed on the circuit board 2130. The controller chip 2136 and the firstpads 2171 a are electrically connected directly through the first signallines 2162. The second pads 2171 b and the first interconnectionterminals 2138 a are electrically connected directly through the secondsignal lines 2163.

The second capacitor pads 2172 are provided for electric connectionbetween the controller chip 2136 and the second interconnectionterminals 2138 b. The second capacitor pads 2172 include third pads 2172a and fourth pads 2172 b. The third and fourth pads 2172 a and 2172 bare spaced a predetermined distance from each other and are disposed toface each other. Third signal lines 2164 and fourth signal lines 2165are formed on the circuit board 2130. The third signal lines 2164 areextended from the first signal lines 2162 and are electrically connectedto the third pads 2172 a. The fourth pads 2172 b and the secondinterconnection terminals 2138 b are electrically connected directlythrough the fourth signal lines 2165.

The first pads 2171 a are electrically connected to the second pads 2171b through a capacitor 2173, or the third pads 2172 a are electricallyconnected to the fourth pads 2172 b through the capacitor 2173. Thecapacitor 2173 may be a DC block capacitor. If the capacitor 2173 isconnected between the first pads 2171 a and the second pads 2171 b, thememory card may be connected to an external electronic machine throughthe first interconnection terminals 2138 a. If the capacitor 2173 isconnected between the third pads 2172 a and the fourth pads 2172 b, thememory card may be connected to an external electronic machine throughthe second interconnection terminals 2138 b.

In example embodiments, the memory card may be or may be used inconjunction with a CompactFlash Type (for example, Type I or II), SDmemory card, miniSD, microSD, TransFlash, MultiMediaCard (MMC), MMCplus,RS-MMC, DV RS-MMC, MMCmobile, MMCmicro, Memory Stick, Memory Stick PRO,Memory Stick Duo, Memory Stick PRO Duo, SmartMedia Card, xD-PictureCard, PC Card (for example, Types I, II, or III), and/or USB FlashDrive.

The above-disclosed subject matter is to be considered illustrative andnot restrictive, and the appended claims are intended to cover all suchmodifications, enhancements, and other embodiments, which fall withinthe true spirit and scope of inventive concepts. Thus, to the maximumextent allowed by law, the scope of inventive concepts is to bedetermined by the broadest permissible interpretation of the followingclaims and their equivalents, and shall not be restricted or limited bythe foregoing detailed description.

What is claimed is:
 1. A socket comprising: a first set ofinterconnection terminals; and a second set of interconnectionterminals, wherein each of the first set of interconnection terminals isconfigured to be operably connected to interconnection terminals of afirst memory card, and at least a portion of the second set ofinterconnection terminals are configured to be inoperable with the firstmemory card when the socket is operably connected with the first memorycard, wherein each of the second set of interconnection terminals isconfigured to be operably connected to interconnection terminals of asecond memory card, and at least a portion of the first set ofinterconnection terminals are configured to be inoperable with thesecond memory card when the socket is operably connected with the secondmemory card, wherein the first set of interconnection terminals and thesecond set of interconnection terminals are connected to a first innersurface of the socket, wherein all terminals of the first set ofinterconnection terminals and the second set of interconnectionterminals physically contact with the first memory card when the socketis operably connected with the first memory card, and wherein allterminals of the first set of interconnection terminals and the secondset of interconnection terminals physically contact with the secondmemory card when the socket is operably connected with the second memorycard.
 2. The socket of claim 1, wherein when the socket is operablyconnected with the first memory card, all of the second set ofinterconnection terminals are configured to be inoperable with the firstmemory card.
 3. The socket of claim 1, wherein when the socket isoperably connected with the second memory card, all terminals of thefirst set of interconnection terminals are configured to be inoperablewith the first memory card.
 4. The socket of claim 1, wherein the firstset of interconnection terminals and the second set of interconnectionterminals are arranged in a receiving space of the socket.
 5. The socketof claim 1, wherein the first set of interconnection terminals includesat least one power terminal.
 6. The socket of claim 1, wherein thesecond set of interconnection terminals includes at least one powerterminal.
 7. The socket of claim 1, wherein at least one of the firstset of interconnection terminals and at least one of the second set ofinterconnection terminals are configured to be used for differentelectronic devices and/or for different purposes.
 8. The socket of claim1, wherein the first set of interconnection terminals includes one powerterminal and one ground terminal, and wherein the second set ofinterconnection terminals includes one power terminal and one groundterminal.
 9. The socket of claim 1, wherein the number of terminals inthe first set of interconnection terminals is different from the numberof terminals in the second set of interconnection terminals.
 10. Asocket comprising: a first set of interconnection terminals including atleast one power terminal; and a second set of interconnection terminalsincluding at least one power terminal, wherein when the socket isoperably connected with a first memory card, the at least one powerterminal of the second set of interconnection terminals is configured tobe inoperable, when the socket is operably connected with a secondmemory card, the second set of interconnection terminals are configuredto be operably connected to interconnection terminals of the secondmemory card, when the socket is operably connected with the secondmemory card, at least a portion of the first set of interconnectionterminals are configured to be inoperable with the second memory card,wherein the first set of interconnection terminals and the second set ofinterconnection terminals are connected to a first inner surface of thesocket, wherein all terminals of the first set of interconnectionterminals and the second set of interconnection terminals physicallycontact with the first memory card when the socket is operably connectedwith the first memory card, and wherein all terminals of the first setof interconnection terminals and the second set of interconnectionterminals physically contact with the second memory card when the socketis operably connected with the second memory card.
 11. The socket ofclaim 10, wherein when the socket is operably connected with the firstmemory card, the first set of interconnection terminals are configuredto be operably connected to interconnection terminals of the firstmemory card.
 12. The socket of claim 10, wherein when the socket isoperably connected with the second memory card, the at least one powerterminal of the first set of interconnection terminals is configured tobe inoperable with the second memory card.
 13. The socket of claim 10,wherein the number of terminals in the first set of interconnectionterminals is different from the number of terminals in the second set ofinterconnection terminals.
 14. A socket comprising: a first set ofinterconnection terminals; and a second set of interconnection terminalsincluding at least one power terminal, wherein when the socket isoperably connected with a first memory card, the at least one powerterminal of the second set of interconnection terminals is configured tobe inoperable, wherein the first set of interconnection terminals andthe second set of interconnection terminals are connected to a firstinner surface of the socket, wherein all terminals of the first set ofinterconnection terminals and the second set of interconnectionterminals physically contact with the first memory card when the socketis operably connected with the first memory card, and wherein allterminals of the first set of interconnection terminals and the secondset of interconnection terminals physically contact with the secondmemory card when the socket is operably connected with the second memorycard.
 15. The socket of claim 14, wherein the first set ofinterconnection terminals includes at least one power terminal.
 16. Thesocket of claim 14, wherein when the socket is operably connected withthe first memory card, the first set of interconnection terminals areconfigured to be operably connected to interconnection terminals of thefirst memory card.
 17. The socket of claim 15, wherein when the socketis operably connected with a second memory card, the at least one powerterminal of the first set of interconnection terminals is configured tobe inoperable.
 18. The socket of claim 14, wherein when the socket isoperably connected with a second memory card, terminals in the secondset of interconnection terminals are configured to be operably connectedto interconnection terminals of the second memory card.
 19. The socketof claim 14, wherein the first set of interconnection terminals and thesecond set of interconnection terminals are arranged in a receivingspace of the socket.
 20. The socket of claim 14, wherein the number ofterminals in the first set of interconnection terminals is differentfrom the number of terminals in the second set of interconnectionterminals.